3838 lamp beads are the opposite of glue dispensing. The glue preparation uses a glue preparation machine to apply silver glue on the back electrode of the uvc led, and then install the uvc led with silver glue on the back of the uvc led bracket. The efficiency of glue preparation is much higher than that of glue dispensing, but not all products are suitable for glue preparation process. Symphony lamp beads are used in: uvc led magic light strip, uvc led magic light strip, uvc led flexible neon tube, uvc led hard light strip, uvc led S-shaped light strip, toys, instruments, digital products and other areas. . The difficulty in the process of UVC lamp beads lies in the control of the amount of glue. There are detailed process requirements for the height of the colloid and the position of the glue. Adhering to "Because we are professional, we can be better" for the purpose of enterprise development and the application of advanced science and technology of energy saving, green and environmental protection, to provide human society with high-end uvc led lamp beads of "low carbon, energy saving and environmental protection". The products are widely researched and used in various lines of jewelry, mobile phones through buttons, LCD backlight, caller ID, flash, switches, telephones, computer data display control systems, electronic electric toys, household appliances, car audio, indicator lights, equipment lights, meters Indicator lights, large network advertising billboards, indoor display screens, etc. He has 12 years of professional knowledge and practical experience in the production and operation of uvc led lamp beads. Generally speaking, whether the staff of uvc led lamp bead can be stable, the quality is good or bad, and the heat dissipation of the lamp itself is very important. At present, the heat dissipation of high-brightness uvc led lamps on the Chinese market often requires a natural environment to dissipate heat. The effect is not very satisfactory. The uvc led lamp made by uvc led light source is composed of uvc led, heat dissipation structure, driver and lens, so the heat dissipation problem is also such a very important part. If the uvc led can not get good heat dissipation, its life will be affected to a certain extent.
1. Heat management is the main research problem in the application of high-brightness uvc led lamp beads
Since the p-type doping of group III nitrides is limited by the solubility of Mg acceptors and the high initial kinetic energy of holes, it is particularly easy to generate heat in the p-type region. This kind of heat must pass through the entire structure to dissipate the heat on the heat sink; the heat dissipation path of the uvc led device is mainly heat conduction and heat convection; the extremely low thermal conductivity of the substrate material causes the thermal resistance of the device to increase, resulting in serious self-heating effect of the device. Destructive influence on the performance and reliability of the device.
2. The effect of heat treatment on high brightness uvc led beads
Heat is concentrated in a chip with a small size, the chip temperature rises, resulting in uneven thermal stress distribution, chip luminous efficiency and phosphor excitation efficiency decrease; when the temperature exceeds a certain value, the failure rate of the device increases exponentially. According to statistics, the reliability of components decreases by 10 per 2℃. When multiple uvc leds are densely arranged to form a white lighting system, the heat dissipation is more serious. Solving the problem of thermal management has become a prerequisite for high-brightness uvc led applications.
3. The relationship between chip size and heat dissipation
The most direct way to increase the brightness of the working power uvc led lamp is to increase the input and output power, and in order to prevent the saturation of the active layer, the size of the pn junction must be increased accordingly; increasing the input signal power will inevitably cause the junction temperature The increase, which in turn reduces the efficiency of quantum technology. The increase in the power of a single tube mainly depends on the ability of the device to extract heat from the pn junction, and it can be used alone while maintaining the company’s existing management chip design materials, structure, packaging processing technology, current passing density on the chip, and equivalent heat dissipation conditions. Increasing the size of a chip, the junction temperature will continue to rise.
