FCOG technology is the combination of chip flipping and heating, using molten tin lead ball and ceramic board. This technology replaces conventional wire bonding and gradually becomes the mainstream packaging in the future. Currently, it is mainly used in high-clock CPU GPU (Graphic Processor Unit) and Chipset products. Compared with COB, the chip structure and the I/O terminal solder ball direction of this package form is downward. Because the I/O terminal is distributed on the entire chip surface, the Flip chip has reached its peak in packaging density and processing speed, especially it can be similar. Processing by means of SMT technology is therefore the ultimate direction of chip packaging technology and high-density mounting.
In the assembly of high-end liquid crystal displays, the glass flip chip FCOG process is commonly used, but the glass flip chip needs to have a protective coating. Solvent coatings are usually used. At present, due to the needs of environmental protection, safety and production efficiency, UV curing The use of protective glue is more common. Since bare chips are more susceptible to external influences, the requirements for LED UV curing sealants are more stringent than flexible terminals.
The bare chip semiconductor components are manufactured, and the product form before packaging is usually in the form of a large wafer or a single chip. After packaging, it becomes a part of semiconductor components, integrated circuits, or more complex circuits (hybrid circuits).
Bare chip UV curing assembly
The IC chip is directly bonded to the glass bottom surface of the liquid crystal display LCD. At present, several types of flip chip (FCOG) technology in which bare chips are pasted on the glass have been developed. This kind of assembly is done with UV-curable adhesives. UV LED UV-curing adhesives are required to have excellent adhesion to glass and bare IC chips and low water absorption, especially UV-curing adhesives should be very high. The purity and extremely low ion content.
The bare chip semiconductor components are manufactured, and the product form before packaging is usually in the form of a large wafer or a single chip. After packaging, it becomes a part of semiconductor components, integrated circuits, or more complex circuits (hybrid circuits).
