The circuit is formed on the silicon substrate, and the circuit has at least one output/input pad. The fixed sealing ring is formed on the silicon substrate and surrounds the circuit and the output/input pad. The ground ring is formed between the silicon substrate and the output/input pad, and is electrically connected to the fixed sealing ring. The guard ring is arranged on the silicon substrate and surrounds the output/input pad for electrical connection with the fixed sealing ring.
The integrated circuit chip UV LED light sealing adopts the principle of combining UV glue and UV light curing. The specific performance is: single-component, easy to use, less waste, fast curing speed, generally a few seconds to tens of seconds can be completely cured, can be used in high-speed production lines, which is conducive to automated production, greatly improving production efficiency; room temperature or It can be cured at low temperature, and can be used for substrates that cannot be cured by heating; save energy, the energy consumed by UV curing can save 90% of energy consumption compared with thermosetting resin; the curing equipment is simple, the area is small, and the cost is saved; the adoption is low Volatile monomers and oligomers do not use solvents, so there is basically no air pollution and no wastewater pollution problems.
