As the focus of my country's light source market, flip-chip cob is a new type of energy-saving, environmentally-friendly green light source product, which will surely become a hot spot in the future development. To integrate light sources with high luminous efficiency and low cost, the heat dissipation problem should be further improved. The LED chip is directly attached to the mirror substrate with high reflectivity, and then through the use of high-efficiency integration technology, a flip-chip cob is formed. This process has no electroplating, no reflow soldering, and no SMT process, and the cost is also reduced. For different application areas, the form of packaging is also different.
At present, the cob packaging method has been recognized in the LED lighting industry. For its cost performance and the comprehensive performance of the light source, flip-chip cob also needs to be improved. In this way, the integrated packaging technology is widely used in indoor and outdoor lighting. The reliability of product quality is effectively improved.
