In response to UV LED packaging requirements, foreign UV LED manufacturers have launched UVCLEDs that use glass packaging, the main method of glass packaging. It can be seen that in order to cope with the high-energy radiation of UV LEDs, packaging methods have begun to consider reducing the use of organic materials, or even completely excluding organic materials to encapsulate UV LEDs, thereby reducing or avoiding the attenuation problems caused by organic materials, moisture and heat stress The problem that caused the failure.
Although some changes have been made in the packaging, except for Nichia (6868 series), it is still a type of product that uses organic materials to encapsulate UVLEDs. The main problem is that due to the short-wave high energy of ultraviolet rays, organic materials are Excitation by ultraviolet light during long-term service accelerates the oxidation of organic materials, resulting in performance deterioration, resulting in a decrease in the radiation intensity of the device.
Although the packaging methods are not the same, B and C are packaged with glass lenses, but it is always unavoidable to use organic filling materials or organic bonding materials in the packaging structure. It is these organic materials that affect the life and stability of the package. And it is impossible to achieve airtight packaging, leading to huge risks in the cold and heat cycle experiment in the reliability of the LED.
Although the modification of organic materials can avoid LED gold wire damage and disconnection failure to a certain extent, organic materials must work under long-term high-intensity ultraviolet radiation conditions and cannot be avoided. Organic materials are exposed to ultraviolet light, heat, and heat for a long time. Reliability is difficult to guarantee when serving under wet and oxygen conditions. Using a laser-like TO method for packaging can avoid the use of organic materials for packaging. The process is quite mature, and its stability is also quite outstanding, and UVC LEDs can be packaged. However, the high-reliability packaging method of the SMD (Surface Mounted Devices) method that can adapt to the SMT (Surface Mount Technology) process needs to be further developed.
