led grow light 3000w

The most important packaging method of LED plant light packaging technology is COB packaging. In addition, there are many other packaging methods, mainly COF packaging, modular packaging, wafer level packaging, flip chip packaging, etc.

 

        COB integrated packaging of LED plant lights has more than 30 packaging structures such as MCOB, COMB, MOFB, MLCOB, etc. COB packaging technology is becoming more mature, and its advantage is low cost. COB packaging now accounts for about 40% of the LED light source market, and COB packaging is the recent development trend of LED plant light packaging.

 

        LED plant light crystal garden-level packaging requires only one dicing from epitaxy to make LED devices, which is a multi-system integrated packaging form required for LED plant growth lights. Generally, the substrate is made of silicon material, without die bonding and pressure welding, and dispensing molding. The formation of system integrated packaging has the advantages of good reliability and low cost, which is one of the development directions of packaging technology.

 

        LED plant growth lamp COF integrated packaging is a large area assembly of medium power LED plant lamp chips on a flexible substrate. This packaging method has the advantages of low cost, high thermal conductivity, thin layer flexibility, high light efficiency, uniform light output, and bendable surface light source. .

 

        The modular integrated packaging of LED plant grow lights generally refers to the system integrated packaging of control parts, LED chips, driving power supplies, parts, etc., called LED modules, which have many advantages such as standardized production, material saving, convenient maintenance, and cost reduction. It is the development direction of LED plant light packaging technology.

 

        Flip-chip packaging technology is a space formed by the substrate, chip, and bumps, so that the packaged chip has the advantages of high performance, small size, short connection, etc., using direct compression, flip-chip chip, ceramic substrate, eutectic The process can meet the performance requirements of high-power lighting.


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